by Key Takeaways
- According to reports, Apple’s own Wi-Fi chips will be used in the iPhone 17.
- Instead of Qualcomm’s 5G modem, Apple’s will be used in the iPhone SE 4.
- Apple wants to lessen its reliance on outside businesses by manufacturing its own connectivity components.
Renowned analyst Ming-Chi Kuo claims that Apple’s proprietary Wi-Fi and Bluetooth chips would be included in the iPhone 17 next year.
According to reports, this action is a component of Apple’s larger plan to lessen its need on Broadcom, which presently provides Apple with more than 300 million connection chips a year. Although it’s unknown how much of an effect this would have on the devices’ wireless performance, Kuo thinks this change will enable Apple to improve its ecosystem integration benefits and reduce production costs.
Additionally, Kuo stated in his post that TSMC will use the N7 process to build Apple’s Wi-Fi chip, which will work with Wi-Fi 7. Higher bandwidth and data transmission rates of up to 40 Gbps will be possible thanks to this. It is anticipated that Apple would switch all of its devices to its own Wi-Fi chips over the course of the following three years.
Kuo also concurs with a prior 9to5Mac report that said Apple’s 5G modem, rather than Qualcomm’s, would be included in the upcoming iPhone SE, which is expected to be released in the spring of 2025. But since the 5G modem and Wi-Fi chips are two distinct parts that need different TSMC procedures, Kuo thought the new SE will still employ Broadcom’s Wi-Fi chip.
Instead of depending on outside vendors, Apple has frequently favored creating its own components. At first, it was thought that the iPhone 15 would be the first product to use Apple’s own connectivity components, but the company eventually fell short of that goal.
